Input-sensing unit and electronic apparatus including the same

ABSTRACT

An input-sensing unit includes first sensing electrodes, second sensing electrodes, first sensing lines, second sensing lines, third sensing lines, and bridge patterns. The second sensing electrodes are electrically insulated from the first sensing electrodes. The first sensing lines are respectively connected to the first sensing electrodes. The second sensing lines are respectively connected to first ends of the second sensing electrodes. The third sensing lines are respectively connected to second ends of the second sensing electrodes. The second ends oppose the first ends. The bridge patterns are respectively connected to the third sensing lines. The bridge patterns are closer to the first ends than to the second ends. The bridge patterns extend in a direction parallel to the third sensing lines.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of U.S. patent application Ser. No.16/904,953, filed Jun. 18, 2020, which claims priority to and thebenefit of Korean Patent Application No. 10-2019-0073293, filed Jun. 20,2019, which is hereby incorporated by reference for all purposes as iffully set forth herein.

BACKGROUND Field

Exemplary embodiments generally relate to an input-sensing unit and anelectronic apparatus including the same, and more particularly, to aninput-sensing unit with improved reliability and an electronic apparatusincluding the same.

Discussion

An electronic apparatus may be activated by an electrical signal. Theelectronic apparatus may include various electronic components, such asa display unit for displaying an image, an input-sensing unit forsensing an external input, etc. The electronic components can beelectrically connected to each other through signal lines, which arevariously arranged. In some instances, the electronic components areelectrically connected to an external circuit through pads. As anintegration density of the electronic components and the number ofsignal lines are increased, the number of the pads also increases. Inaddition, as the number of signal lines increases, it is may benecessary to develop a fine patterning process to form fine signallines.

The above information disclosed in this section is only forunderstanding the background of the inventive concepts, and, therefore,may contain information that does not form prior art.

SUMMARY

Some aspects provide an input-sensing unit capable of increasing processreliability and electric reliability.

Some aspects provide an electronic apparatus including an input-sensingunit capable of increasing process reliability and electric reliability.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concepts.

According to some aspects, an input-sensing unit includes first sensingelectrodes, second sensing electrodes, first sensing lines, secondsensing lines, third sensing lines, and bridge patterns. The secondsensing electrodes are electrically insulated from the first sensingelectrodes. The first sensing lines are respectively connected to thefirst sensing electrodes. The second sensing lines are respectivelyconnected to first ends of the second sensing electrodes. The thirdsensing lines are respectively connected to second ends of the secondsensing electrodes. The second ends oppose the first ends. The bridgepatterns are respectively connected to the third sensing lines. Thebridge patterns are closer to the first ends than to the second ends.The bridge patterns extend in a direction parallel to the third sensinglines.

According to some aspects, an electronic apparatus includes a displayunit and an input-sensing unit. The display unit includes a basesubstrate, and pixels disposed on the base substrate. The input-sensingunit is disposed on the display unit. The input-sensing unit includessensing electrodes, first sensing lines, second sensing lines, andbridge patterns. The first sensing lines are respectively connected tofirst ends of the sensing electrodes. The second sensing lines arerespectively connected to second ends of the sensing electrodes. Thesecond ends oppose the first ends. The bridge patterns cross at leastsome of the first sensing lines and are respectively connected to thesecond sensing lines. The bridge patterns are closer to the first endsthan to the second ends. The bridge patterns are respectively disposedon the second sensing lines.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concepts, and, together with thedescription, serve to explain principles of the inventive concepts.

FIG. 1A is a perspective view illustrating an electronic apparatusaccording to some exemplary embodiments.

FIG. 1B is an exploded perspective view of the electronic apparatusshown in FIG. 1A according to some exemplary embodiments.

FIG. 2A is a plan view illustrating a display unit according to someexemplary embodiments.

FIG. 2B is a plan view illustrating an input-sensing unit according tosome exemplary embodiments.

FIG. 3A is a plan view illustrating a portion of an input-sensing unitaccording to some exemplary embodiments.

FIG. 3B is a sectional view taken along sectional line I-I′ of FIG. 3Aaccording to some exemplary embodiments.

FIG. 4A is a plan view illustrating a portion of an input-sensing unitaccording to some exemplary embodiments.

FIG. 4B is a sectional view taken along sectional line II-IP of FIG. 4Aaccording to some exemplary embodiments.

FIG. 5 is a plan view illustrating a portion of an input-sensing unitaccording to some exemplary embodiments.

FIG. 6 is a plan view illustrating a portion of an input-sensing unitaccording to some exemplary embodiments.

FIG. 7A is a sectional view taken along sectional line of FIG. 6according to some exemplary embodiments.

FIG. 7B is a sectional view taken along sectional line IV-IV′ of FIG. 6according to some exemplary embodiments.

FIG. 7C is a sectional view taken along sectional line V-V′ of FIG. 6according to some exemplary embodiments.

FIG. 8A is a plan view illustrating a portion of an input-sensing unitaccording to some exemplary embodiments.

FIG. 8B is a sectional view of the structure shown in FIG. 8A accordingto some exemplary embodiments.

FIG. 9A is a plan view illustrating a portion of an input-sensing unitaccording to some exemplary embodiments.

FIG. 9B is a sectional view of the structure shown in FIG. 9A accordingto some exemplary embodiments.

FIGS. 10A and 10B are plan views illustrating portions of input-sensingunits according to various exemplary embodiments.

FIGS. 11A and 11B are exploded perspective views illustrating anelectronic apparatus according to various exemplary embodiments.

FIG. 12A is an exploded perspective view illustrating an electronicpanel according to some exemplary embodiments.

FIG. 12B is a plan view illustrating an electronic panel according tosome exemplary embodiments.

DETAILED DESCRIPTION OF SOME EXEMPLARY EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. As used herein, theterms “embodiments” and “implementations” are used interchangeably andare non-limiting examples employing one or more of the inventiveconcepts disclosed herein. It is apparent, however, that variousexemplary embodiments may be practiced without these specific details orwith one or more equivalent arrangements. In other instances, well-knownstructures and devices are shown in block diagram form in order to avoidunnecessarily obscuring various exemplary embodiments. Further, variousexemplary embodiments may be different, but do not have to be exclusive.For example, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someexemplary embodiments. Therefore, unless otherwise specified, thefeatures, components, modules, layers, films, panels, regions, aspects,etc. (hereinafter individually or collectively referred to as an“element” or “elements”), of the various illustrations may be otherwisecombined, separated, interchanged, and/or rearranged without departingfrom the inventive concepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. As such, thesizes and relative sizes of the respective elements are not necessarilylimited to the sizes and relative sizes shown in the drawings. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element, it may be directly on,connected to, or coupled to the other element or intervening elementsmay be present. When, however, an element is referred to as being“directly on,” “directly connected to,” or “directly coupled to” anotherelement, there are no intervening elements present. Other terms and/orphrases used to describe a relationship between elements should beinterpreted in a like fashion, e.g., “between” versus “directlybetween,” “adjacent” versus “directly adjacent,” “on” versus “directlyon,” etc. Further, the term “connected” may refer to physical,electrical, and/or fluid connection. In addition, the DR1-axis, theDR2-axis, and the DR3-axis are not limited to three axes of arectangular coordinate system, and may be interpreted in a broadersense. For example, the DR1-axis, the DR2-axis, and the DR3-axis may beperpendicular to one another, or may represent different directions thatare not perpendicular to one another. For the purposes of thisdisclosure, “at least one of X, Y, and Z” and “at least one selectedfrom the group consisting of X, Y, and Z” may be construed as X only, Yonly, Z only, or any combination of two or more of X, Y, and Z, such as,for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items.

Although the terms “first,” “second,” etc. may be used herein todescribe various elements, these elements should not be limited by theseterms. These terms are used to distinguish one element from anotherelement. Thus, a first element discussed below could be termed a secondelement without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one element's relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional views, isometric views, perspective views, plan views, and/orexploded illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result of, forexample, manufacturing techniques and/or tolerances, are to be expected.Thus, exemplary embodiments disclosed herein should not be construed aslimited to the particular illustrated shapes of regions, but are toinclude deviations in shapes that result from, for instance,manufacturing. To this end, regions illustrated in the drawings may beschematic in nature and shapes of these regions may not reflect theactual shapes of regions of a device, and, as such, are not intended tobe limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

As customary in the field, some exemplary embodiments are described andillustrated in the accompanying drawings in terms of functional blocks,units, and/or modules. Those skilled in the art will appreciate thatthese blocks, units, and/or modules are physically implemented byelectronic (or optical) circuits, such as logic circuits, discretecomponents, microprocessors, hard-wired circuits, memory elements,wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units, and/or modules beingimplemented by microprocessors or other similar hardware, they may beprogrammed and controlled using software (e.g., microcode) to performvarious functions discussed herein and may optionally be driven byfirmware and/or software. It is also contemplated that each block, unit,and/or module may be implemented by dedicated hardware, or as acombination of dedicated hardware to perform some functions and aprocessor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit, and/ormodule of some exemplary embodiments may be physically separated intotwo or more interacting and discrete blocks, units, and/or moduleswithout departing from the inventive concepts. Further, the blocks,units, and/or modules of some exemplary embodiments may be physicallycombined into more complex blocks, units, and/or modules withoutdeparting from the inventive concepts.

Hereinafter, various exemplary embodiments will be explained in detailwith reference to the accompanying drawings

FIG. 1A is a perspective view illustrating an electronic apparatusaccording to some exemplary embodiments. FIG. 1B is an explodedperspective view of the electronic apparatus shown in FIG. 1A accordingto some exemplary embodiments. Hereinafter, some embodiments will bedescribed with reference to FIGS. 1A and 1B.

An electronic apparatus EA may be selectively activated by an electricalsignal applied thereto. The electronic apparatus EA may be implementedin various forms. For example, the electronic apparatus EA may be one oftablets, laptop computers, computers, smart televisions, etc. Fordescriptive convenience, the electronic apparatus EA will be describedas a smart phone, such as illustrated in FIG. 1A.

The electronic apparatus EA may include a display surface FS, which isparallel to each of a first direction DR1 and a second direction DR2,and is used to display an image IM in a third direction DR3. The displaysurface FS, on which the image IM is displayed, may correspond to afront or top surface of the electronic apparatus EA and may correspondto a front surface FS of a window 100. Hereinafter, the display surface(e.g., the front surface) FS of the electronic apparatus EA and thefront surface FS of the window 100 may be indicated using the samereference character. The image IM may be a video image and/or a stillimage. As shown in FIG. 1A, a clock icon and a plurality of applicationicons may be displayed as parts of the image IM, but embodiments are notlimited thereto.

According to some exemplary embodiments, a front or top surface and arear or bottom surface of each element may be defined based on thedisplay direction of the image IM. For instance, the front surface andthe rear surface may be opposite to each other in the third directionDR3, and a direction normal to each of the front and rear surfaces maybe parallel to the third direction DR3. A distance between the front andrear surfaces in the third direction DR3 may correspond to a thicknessof an electronic panel 200, e.g., a display panel, in the thirddirection DR3. Directions indicated by the first to third directionsDR1, DR2, and DR3 may be relative concept, and in some embodiments, maybe changed to indicate other directions.

The electronic apparatus EA according to some exemplary embodiments maysense a user's input TC provided from the outside. The user's input TCmay include various types of external inputs, such as a part of a user'sbody, light, heat, and/or pressure. The user's input TC is exemplarilyillustrated to be an input to the front surface FS through a user'shand; however, embodiments are not limited to this example. The user'sinput TC may be provided in various forms such as described above. Inaddition, the electronic apparatus EA may sense the user's input TC,which is applied through at least one of a side and rear surface of theelectronic apparatus EA, depending on a structure of the electronicapparatus EA, but embodiments are not limited to this example or aspecific embodiment.

The electronic apparatus EA may further include an electronic panel 200and an outer case 300, in addition to the window 100. In someembodiments, the window 100 and the outer case 300 may be combined toeach other to form an outer appearance of the electronic apparatus EA.

The window 100 may include an insulating panel. For example, the window100 may be formed of or include at least one of glass, plastic, andcombinations thereof.

The front surface FS of the window 100 may define the front surface ofthe electronic apparatus EA, as described above. The front surface FS ofthe window 100 may include a transmission region TA and a bezel regionBZA. The transmission region TA may be an optically transparent region.For example, the transmission region TA may be a region withtransmittance to visible light being about 90% or higher.

The bezel region BZA may have relatively low optical transmittance ascompared with the transmission region TA. The bezel region BZA maydefine the shape of the transmission region TA. The bezel region BZA maybe adjacent to the transmission region TA and, in some embodiments, mayenclose the transmission region TA.

The bezel region BZA may have a predetermined color. The bezel regionBZA may cover a peripheral region NAA of the electronic panel 200 andmay prevent the peripheral region NAA from being recognized by a user.However, embodiments are not limited to this example, and in someexemplary embodiments, the bezel region BZA may be omitted from thewindow 100.

The electronic panel 200 may display the image IM and sense the user'sinput TC. The image IM may be displayed on a front surface IS of theelectronic panel 200. The front surface IS of the electronic panel 200may include an active region AA and the peripheral region NAA. Theactive region AA may be a region that is selectively activated by anelectrical signal.

In some embodiments, the active region AA may be a region used todisplay the image IM and to sense the user's input TC. The transmissionregion TA may be overlapped with at least a portion of the active regionAA. For example, the transmission region TA may be overlapped with afront surface of the active region AA or with at least a portion of thefront surface of the active region AA. Thus, a user may recognize theimage IM through the transmission region TA or may provide the user'sinput TC through the transmission region TA. However, embodiments arenot limited to this example or a specific embodiment, and in someexemplary embodiments, the active region AA may be divided into a regionfor displaying the image IM and another region for sensing the user'sinput TC.

The peripheral region NAA may be a region covered with the bezel regionBZA. The peripheral region NAA may be adjacent to the active region AA.The peripheral region NAA may enclose the active region AA. A drivingcircuit or a driving line, which is used to drive the active region AA,may be disposed in the peripheral region NAA.

The electronic panel 200 may include a display unit 210, aninput-sensing unit 220, a display driving circuit DIC, and a sensingcircuit substrate FTC.

The display unit 210 may be an element that substantially produces theimage IM. The image IM, which is produced by the display unit 210, maybe displayed on the display surface FS through the transmission regionTA and may be recognized by a user.

The input-sensing unit 220 may sense the user's input TC applied from anoutside of the electronic apparatus EA. As described above, theinput-sensing unit 220 may sense the user's input TC provided to thewindow 100.

The display driving circuit DIC may be disposed in the display unit 210.The display driving circuit DIC may be mounted on the display unit 210.The display driving circuit DIC may be electrically connected to thedisplay unit 210 and may provide electrical signals, which are used todrive the display unit 210, to the display unit 210.

The sensing circuit substrate FTC may be electrically connected to theinput-sensing unit 220. In some embodiments, the sensing circuitsubstrate FTC may include a flexible circuit board CF and a sensingdriver circuit TIC. The flexible circuit board CF may include lines. Thelines may electrically connect the input-sensing unit 220 to the sensingdriver circuit TIC. The sensing driver circuit TIC may be mounted on theflexible circuit board CF (e.g., in the form of a chip-on film). Theinput-sensing unit 220 may receive electrical signals, which areindependently provided from the display unit 210 through the sensingcircuit substrate FTC.

The outer case 300 may be combined with the window 100 to define anouter appearance of the electronic apparatus EA. The outer case 300 mayprovide an internal space. The electronic panel 200 may be contained inthe internal space, which is provided by the outer case 300.

The outer case 300 may be formed of or include a material having arelatively high hardness. For example, the outer case 300 may include atleast one of glass, plastic, and metallic materials or may include aplurality of frames and/or plates that are made of at least one of theglass, plastic, and metallic materials. The outer case 300 may stablyprotect components of the electronic apparatus EA, which are containedin the internal space, from an external impact.

FIG. 2A is a plan view illustrating a display unit according to someexemplary embodiments. FIG. 2B is a plan view illustrating an inputsensing unit according to some exemplary embodiments. For convenience inillustration, some elements are omitted from FIGS. 2A and 2B.Hereinafter, a some exemplary embodiments will be described withreference to FIGS. 2A and 2B.

Some elements (e.g., a base substrate BS, a plurality of pixels PX, anda plurality of signal lines GL, DL, and PL) constituting the displayunit 210, and the display driving circuit DIC are illustrated in FIG.2A. The display driving circuit DIC may include a gate driving circuitIC1 and a data driving circuit IC2.

The active region AA and the peripheral region NAA may be defined in (oron) the base substrate BS. The base substrate BS may include aninsulating substrate. For example, the base substrate BS may include atleast one of a glass substrate, a plastic substrate, and combinationsthereof.

The signal lines GL, DL, and PL may be connected to the pixels PX andmay be used to deliver electrical signals to the pixels PX. The signallines GL, DL, and PL in the display unit 210 may include a gate line GL,a data line DL, and a power line PL, as exemplarily shown in FIG. 2A.However, embodiments are not limited to this example or a specificembodiment, and in some exemplary embodiments, the signal lines GL, DL,and PL may further include at least one of a power line, aninitialization voltage line, and an emission control line.

In an embodiment, a plurality of the gate lines GL may be provided, andeach of the gate lines GL may be connected to the gate driving circuitIC1. The gate driving circuit IC1 may sequentially provide gate signalsto corresponding ones of the gate lines GL. Each of the pixels PX may beturned on or off by the gate signal applied thereto.

The data line DL may be provided to cross the gate line GL and may beelectrically insulated from the gate line GL. In an embodiment, aplurality of the data lines DL may be provided, and each of the datalines DL may be connected to the data driving circuit IC2. The datadriving circuit IC2 may provide data signals to corresponding ones ofthe data lines DL. The pixels PX may display light(s) corresponding tothe data signals.

Each of the pixels PX may display light in the active region AA. In someembodiments, an example circuit diagram of one of the pixels PX isillustrated in an enlarged manner. The pixel PX may include a first thinfilm transistor TR1, a capacitor CAP, a second thin film transistor TR2,and an emission element EMD. The first thin film transistor TR1 may be aswitching device used to control the on/off operation of the pixel PX.The first thin film transistor TR1 may transmit or block a data signaltransmitted through the data line DL in response to a scan signaltransmitted through the gate line GL.

The capacitor CAP may be connected to the first thin film transistor TR1and the power line PL. The capacitor CAP may be used to store electriccharge, and an amount of the electric charge stored in the capacitor CAPmay be determined by a voltage difference between the data signaltransmitted from the first thin film transistor TR1 and a first powersignal applied to the power line PL.

The second thin film transistor TR2 may be connected to the first thinfilm transistor TR1, the capacitor CAP, and the emission element EMD.The second thin film transistor TR2 may control a driving currentflowing through the emission element EMD based on an amount of chargestored in the capacitor CAP. A turn-on time of the second thin filmtransistor TR2 may be determined depending on the amount of chargestored in the capacitor CAP. During the turn-on time of the second thinfilm transistor TR2, the second thin film transistor TR2 may provide thefirst power signal, which is transferred through the power line PL, tothe emission element EMD.

The emission element EMD may generate light or control an amount oflight according to an electrical signal. For example, the emissionelement EMD may include an organic light emitting device, a quantum dotlight emitting device, a micro light emitting device, a nano lightemitting device, an electrophoretic device, or an electrowetting device,but exemplary embodiments are not limited thereto.

The emission element EMD may be connected to a power terminal VSS andmay receive a power signal (hereinafter, a second power signal), whichis different from the first power signal provided through the power linePL. A difference in voltage between the electrical signal provided fromthe second thin film transistor TR2 and the second power signal maydetermine an amount of the driving current flowing through the emissionelement EMD, and in this case, an intensity of the light generated bythe emission element EMD may be determined by the amount of the drivingcurrent. However, embodiments are not limited to this example or aspecific embodiment, and in some exemplary embodiments, the pixel PX mayinclude electronic devices provided in various structures orarrangements.

The input-sensing unit 220 may be disposed on the display unit 210. Theinput-sensing unit 220 may sense the user's input TC and may obtaininformation on the position and strength of the user's input TC. Theinput-sensing unit 220 may include a plurality of sensing electrodes SE1and SE2, a plurality of sensing lines SL1, SL2 and SL3, and a pluralityof sensing pads PDT.

The sensing electrodes SE1 and SE2 may be disposed in the active regionAA. The sensing electrodes SE1 and SE2 may include a plurality of firstsensing electrodes SE1 and a plurality of second sensing electrodes SE2that receive different electrical signals from each other. Theinput-sensing unit 220 may obtain information on the user's input TC,which is provided to the active region AA, from a change in capacitancebetween the first sensing electrodes SE1 and the second sensingelectrodes SE2. However, embodiments are not limited to this example,and in some exemplary embodiments, the input-sensing unit 220 may obtaininformation on the user's input TC, which is provided to the activeregion AA, from a change in resistance between the first and secondsensing electrodes SE1 and SE2 or a change resistance or capacitance ofeach of the sensing electrodes SE1 and SE2. Furthermore, theinput-sensing unit 220 may be operated in various manners, andembodiments are not limited to a specific operation method of theinput-sensing unit 220.

The first sensing electrodes SE1 may be arranged to be spaced apart fromeach other in the second direction DR2 and may extend in the firstdirection DR1. Each of the first sensing electrodes SE1 may include aplurality of first sensing patterns SP1 and a plurality of firstconnection patterns BP1, which are arranged in the first direction DR1.

The first sensing patterns SP1 and the first connection patterns BP1 maybe alternately arranged in the first direction DR1. Each of the firstconnection patterns BP1 may connect two adjacent patterns of the firstsensing patterns SP1. For convenience in illustration, the first sensingpatterns SP1 are depicted as shaded patterns.

The second sensing electrodes SE2 may be arranged to be spaced apartfrom each other in the first direction DR1 and may extend in the seconddirection DR2. The second sensing electrodes SE2 may include a pluralityof second sensing patterns SP2 and a plurality of second connectionpatterns BP2, which are arranged in the second direction DR2. The secondsensing patterns SP2 and the second connection patterns BP2 may bealternately arranged in the second direction DR2. Each of the secondconnection patterns BP2 may connect two adjacent patterns of the secondsensing patterns SP2.

In some embodiments, the first connection patterns BP1 and the secondconnection patterns BP2 may be disposed on different layers, and thefirst sensing patterns SP1 and the second sensing patterns SP2 may bedisposed on the same layer. For example, the first connection patternsBP1 may be disposed on a layer different from a layer on which thesecond connection patterns BP2, the first sensing patterns SP1, and thesecond sensing patterns SP2 are disposed, and the second connectionpatterns BP2, the first sensing patterns SP1, and the second sensingpatterns SP2 may be disposed on the same layer.

However, embodiments are not limited to this example or a specificembodiment. For example, in some exemplary embodiments, the firstconnection patterns BP1 may be disposed on the same layer as a layer onwhich the first sensing patterns SP1 and the second sensing patterns SP2are disposed, and in another exemplary embodiment, the first sensingelectrodes SE1 and the second sensing electrodes SE2 may be disposed ondifferent layers.

The sensing lines SL1, SL2 and SL3 and the sensing pads PDT may bedisposed in the peripheral region NAA. The sensing pads PDT may beconnected to the sensing lines SL1, SL2 and SL3 respectively. Thesensing lines SL1, SL2 and SL3 may include a plurality of first sensinglines SL1, a plurality of second sensing lines SL2 and a plurality ofthird sensing lines SL3. The first sensing lines SL1 and the secondsensing lines SL2 may be disposed on a same layer as the third sensinglines SL3.

The first sensing lines SL1 may be respectively connected to first endsSE1 S1 of the first sensing electrodes SE1 that oppose second ends SE1S2 of the first sensing electrodes SE1. The first sensing lines SL1 mayconnect first pads T1 of the sensing pads PDT to the first sensingelectrodes SE1, respectively, and may deliver electrical signals, whichare provided from the outside, to the first sensing electrodes SE1.

The second sensing lines SL2 may be respectively connected to first endsSE2_S1 of the second sensing electrodes SE2. The first ends SE2_S1 ofthe second sensing electrodes SE2 may be portions of the second sensingelectrodes SE2 that are located relatively close to the sensing padsPDT. The second sensing lines SL2 may connect second pads T2 of thesensing pads PDT to the second sensing electrodes SE2, respectively, andmay deliver electrical signals, which are provided from the outside, tothe second sensing electrodes SE2.

The third sensing lines SL3 may be respectively connected to oppositesecond ends SE2_S2 of the second sensing electrodes SE2. The second endsSE2_S2 of the second sensing electrodes SE2 may be portions of thesecond sensing electrodes SE2 that are opposite to the first ends SE2_S1of the second sensing electrodes SE2.

In an embodiment, the second sensing electrodes SE2 may be connected tothe second sensing lines SL2 and the third sensing lines SL3. Forinstance, when the second sensing electrodes SE2 are longer than thefirst sensing electrodes SE1, both of ends SE2_S1 and SE2_S2 of thesecond sensing electrodes SE2 are connected to the second and thirdsensing lines SL2 and SL3 respectively. Therefore, it may be possible toprevent sensitivity of the second sensing electrode SE2 from beingvaried according to the position.

The third sensing lines SL3 may be coupled to the second sensing linesSL2, respectively. The input-sensing unit 220 may include a plurality ofcoupling portions CT. The third sensing lines SL3 may be electricallyconnected to corresponding ones of the second sensing lines SL2 throughthe coupling portions CT. Thus, the third sensing lines SL3 may transmitsubstantially the same electrical signal as that transmitted by acorresponding one of the second sensing lines SL2.

The input-sensing unit 220 may provide electrical signals to the secondsensing lines SL2 and the third sensing lines SL3 through the secondpads T2. According to some exemplary embodiments, the input-sensing unit220 may be provided to realize substantially uniform sensitivitythroughout the front surface of the active region AA without increasingan area of the sensing pads PDT.

FIG. 3A is a plan view illustrating a portion of an input-sensing unitaccording to some exemplary embodiments. FIG. 3B is a sectional viewtaken along sectional line I-I′ of FIG. 3A according to some exemplaryembodiments. FIG. 4A is a plan view illustrating a portion of aninput-sensing unit according to some exemplary embodiments. FIG. 4B is asectional view taken along sectional line II-IP of FIG. 4A according tosome exemplary embodiments.

FIG. 3A illustrates a region AN of FIG. 2B, and FIG. 4A illustrates aregion corresponding to FIG. 3A. Hereinafter, some exemplary embodimentswill be described with reference to FIGS. 3A, 3B, 4A, and 4B. Forconcise description, an element previously described with reference toFIGS. 1A to 2B may be identified by the same (or similar) referencenumber without repeating an overlapping description thereof.

As shown in FIG. 3A, the region AA′ may be a region in which the firstconnection pattern BP1 and the second connection pattern BP2 cross eachother. For convenience in illustration, two patterns (e.g., SP11 andSP12) of the first sensing patterns SP1 (refer to FIG. 2B) connected tothe first connection pattern BP1 and two patterns (e.g., SP21 and SP22)of the second sensing patterns SP2 (refer to FIG. 2B) connected to thesecond connection pattern BP2 are exemplarily illustrated in FIG. 3A.

Referring to FIGS. 3A and 3B, the first connection pattern BP1 and thesecond connection pattern BP2 may cross each other when viewed in a planview. The first connection pattern BP1 and the second connection patternBP2 may be disposed on different layers. In some embodiments, the firstconnection pattern BP1 may be disposed between a second sensinginsulating layer 222 and a third sensing insulating layer 223, and thesecond connection pattern BP2 may be disposed between a first sensinginsulating layer 221 and the second sensing insulating layer 222.

The first sensing patterns SP11 and SP12 may be spaced apart from thesecond sensing patterns SP21 and SP22, when viewed in a plan view. Thefirst sensing patterns SP11 and SP12 and the second sensing patternsSP21 and SP22 may be disposed on the same layer. The first sensingpatterns SP11 and SP12 may be electrically insulated from the secondsensing patterns SP21 and SP22. In some embodiments, the first sensingpatterns SP11 and SP12 and the first connection pattern BP1 areintegrally formed each other.

The first sensing patterns SP11 and SP12 and the second sensing patternsSP21 and SP22 may be disposed on the same level as a layer on which thefirst connection pattern BP1 is disposed or on the same layer. Thesecond sensing patterns SP21 and SP22 may penetrate the second sensinginsulating layer 222 and may be coupled to the second connection patternBP2.

In some embodiments, the first connection pattern BP1 and the secondconnection pattern BP2 may be formed of or include different materials.In some embodiments, the first connection pattern BP1 may be opticallytransparent, and the second connection pattern BP2 may be opticallyopaque. For example, the first connection pattern BP1 may be formed ofor include transparent conductive oxide (TCO), and the second connectionpattern BP2 may be formed of or include at least one of metals andconductive polymers.

However, embodiments are not limited to this example, and in someexemplary embodiments, the first connection pattern BP1 may be opticallyopaque and the second connection pattern BP2 may be opticallytransparent. Alternatively, both of the first and second connectionpatterns BP1 and BP2 may be optically transparent or optically opaque,or the first and second connection patterns BP1 and BP2 may be formed ofor include the same material. The structure and materials of theinput-sensing unit 220 may be variously changed, and embodiments notlimited to a specific embodiment.

As shown in FIGS. 4A and 4B, a second connection pattern BP2-1 mayinclude a plurality of second connection patterns BP21 and BP22, whichare spaced apart from each other. Second sensing patterns SP21-1 andSP22-1 may be connected to each other through the second connectionpatterns BP21 and BP22. Accordingly, even when one of the secondconnection patterns BP21 and BP22 is damaged, it may be possible tostably maintain the electric connection between the second sensingpatterns SP21-1 and SP22-1.

Each of the second connection patterns BP21 and BP22 may include a firstportion B1, a second portion B2, and a third portion B3. The firstportion B1 may connect one (e.g., second sensing pattern SP21-1) of thesecond sensing patterns SP21-1 and SP22-1 to the second portion B2, andthe third portion B3 may connect the other (e.g., second sensing patternSP22-1) of the second sensing patterns SP21-1 and SP22-1 to the secondportion B2.

The second portion B2 and a first connection pattern BP1-1 may bedisposed on the same layer. The second portion B2 may be spaced apartfrom the first connection pattern BP1-1 when viewed in a plan view or across-sectional view. The second portion B2 may be electricallyinsulated from the first connection pattern BP1-1.

In the input-sensing unit 220 according to some exemplary embodiments,the structures of the first sensing patterns SP11, SP12, SP11-1, andSP12-1 and the second sensing patterns SP21, SP22, SP21-1, and SP22-1may be variously changed, as long as the first sensing patterns SP11,SP12, SP11-1, and SP12-1 are electrically insulated from the secondsensing patterns SP21, SP22, SP21-1, and SP22-1, and embodiments are notlimited to a specific embodiment.

FIG. 5 is a plan view illustrating a portion of an input-sensing unitaccording to some exemplary embodiments. For instance, a region in whichthe coupling portions CT electrically connecting the third sensing linesSL3 to the second sensing lines SL2 are defined is illustrated in FIG. 5. Hereinafter, some exemplary embodiments will be described withreference to FIG. 5 .

The first sensing lines SL1 may include m first sensing lines SL1 ₁ toSL1 _(m), such as shown in FIG. 5 . The 1^(st) to m-th first sensinglines SL1 ₁ to SL1 _(m) may be disposed in a region adjacent to thecoupling portions CT and may be sequentially arranged in the firstdirection DR1. The first sensing lines SL1 may be connected to the firstpads T1, respectively. The first sensing lines SL1 may independentlydeliver respective electrical signals through the first pads T1.

The second sensing lines SL2 may include n second sensing lines SL2 ₁,SL2 ₂, . . . , SL2 _(n−1), and SL2 _(n), such as shown in FIG. 5 . The1st to n-th line SL2 ₁ to SL2 _(n) of the second sensing line SL2 may bedisposed in a region adjacent to the coupling portions CT and may besequentially arranged in the first direction DR1. The second sensinglines SL2 may be connected to the second pads T2, respectively. Thesecond sensing lines SL2 may independently deliver respective electricalsignals through the second pads T2.

The third sensing lines SL3 may be provided in the same number as thesecond sensing lines SL2. For instance, the third sensing lines SL3 mayinclude n third sensing lines SL3 ₁, SL3 ₂, . . . , SL3 _(n−1), and SL3_(n), such as shown in FIG. 5 . The 1st to n-th lines SL3 ₁ to SL3 _(n)of the third sensing lines SL3 may extend in the first direction DR1 ina region adjacent to the coupling portions CT and may be sequentiallyarranged in the second direction DR2.

The third sensing lines SL3 may be connected to the second sensing linesSL2. The third sensing lines SL3 may be connected to the second sensinglines SL2 in a one-to-one manner. The third sensing lines SL3 maydeliver the same electrical signals as those delivered by the secondsensing lines SL2.

The third sensing lines SL3 may be connected to the second sensing linesSL2 through a plurality of bridge patterns CP. The bridge patterns CPmay be arranged in the second direction DR2 and may extend in the firstdirection DR1. The bridge patterns CP may be provided to cross thesecond sensing lines SL2 and may be electrically insulated from thesecond sensing lines SL2 apart from the coupling portions CT. The bridgepatterns CP may be overlapped with the second sensing lines SL2 whenviewed in a plan view.

In some embodiments, the bridge patterns CP are illustrated to have alength, which is overlapped with n second sensing lines SL2 and to havethe same shape. However, embodiments are not limited to this example,and in some embodiments, the bridge patterns CP may be provided to havedifferent shapes from each other, and embodiments are not limited to aspecific embodiment.

In some embodiments, the first to third sensing lines SL1 to SL3 mayinclude at least one of metals and conductive polymers. Also, each ofthe bridge patterns CP may comprise transparent conductive oxide.

The bridge patterns CP may be provided in the same number as the thirdsensing lines SL3. In some embodiments, the second sensing lines SL2 andthe third sensing lines SL3 may be spaced apart from each other and maynot be overlapped with each other when viewed in a plan view. The bridgepatterns CP may electrically connect the second sensing lines SL2 to thethird sensing lines SL3 which are spaced apart from the second sensinglines SL2.

The bridge patterns CP may connect the third sensing lines SL3 to thesecond sensing lines SL2 in a one-to-one manner. Each of the thirdsensing lines SL3 may be connected to a corresponding one of the secondsensing lines SL2 through a corresponding one of the bridge patterns CP.

Each of the bridge patterns CP may be coupled to a corresponding one ofthe second sensing lines SL2 and a corresponding one of the thirdsensing lines SL3 through the coupling portion CT. The coupling portionCT may include a first coupling portion CT_S and a second couplingportion CT_L. The first coupling portion CT_S may electrically connectthe bridge patterns CP to the second sensing lines SL2. The secondcoupling portion CT_L may electrically connect the bridge patterns CP tothe third sensing lines SL3.

A first line SL3 ₁ of the third sensing lines SL3 may be coupled to afirst line SL2 ₁ of the second sensing lines SL2 through one bridgepattern CP. A second line SL3 ₂ of the third sensing lines SL3 may becoupled to a second line SL2 ₂ of the second sensing lines SL2 throughone bridge pattern CP. Similarly, each of an (n−1)-th line SL3 _(n−1) ofthe third sensing lines SL3 and an n-th line SL3 _(n) of the thirdsensing lines SL3 may be coupled to a corresponding one of an (n−1)-thline SL2 _(n−1) of the second sensing lines SL2 and an n-th line SL2_(n) of the second sensing lines SL2 through one bridge pattern CP.

In an embodiment, the third sensing lines SL3 may be connected to thesecond sensing lines SL2 _(n) instead of additional pads, and mayindependently deliver respective electrical signals. Accordingly, it maybe possible to provide electrical signals to the first ends SE2_S1 andsecond ends SE2_S2 (refer to FIG. 2B) of the second sensing electrodesSE2 (refer to FIG. 2B) through only the second pads T2 (refer to FIG.2B), without adding pads to provide electrical signals to the thirdsensing lines SL3.

FIG. 6 is a plan view illustrating a portion of an input-sensing unitaccording to some exemplary embodiments. FIG. 7A is a sectional viewtaken along sectional line III-III′ of FIG. 6 according to someexemplary embodiments. FIG. 7B is a sectional view taken along sectionalline IV-IV′ of FIG. 6 according to some exemplary embodiments. FIG. 7Cis a sectional view taken along sectional line V-V′ of FIG. 6 accordingto some exemplary embodiments. For convenience in description, FIG. 6shows an enlarged shape of only some elements shown in FIG. 5 .Hereinafter, some exemplary embodiments will be described with referenceto FIGS. 6 to 7C. For concise description, an element previouslydescribed with reference to FIGS. 1A to 5 may be identified by the same(or similar) reference number without repeating an overlappingdescription thereof.

Referring to FIG. 6 , third sensing lines SL3 _(k) and SL3 _(k+1) (wherek<n) may be disposed to be spaced apart from the n-th line SL2 _(n) ofthe second sensing lines SL2, which is the closest one of the secondsensing lines SL2 (see, e.g., FIG. 5 ), by a distance DS. The distanceDS may be the minimum distance in the first direction DR1 between endportions of the third sensing lines SL3 _(k) and SL3 _(k+1) and the n-thline SL2 _(n) of the second sensing lines SL2.

The third sensing lines SL3 _(k) and SL3 _(k+1) may be spaced apart fromeach other by a first gap G1 and each of them may have a first width W1.The first gap G1 and the first width W1 may be values defined in thesecond direction DR2. In some embodiments, the third sensing lines SL3_(k) and SL3 _(k+1) are illustrated to have the same width (e.g., thefirst width W1), but embodiments are not limited to this example or aspecific embodiment. For example, in some embodiments, the third sensinglines SL3 _(k) and SL3 _(k+1) may be provided to have different widths.

Bridge patterns CP1 and CP2, which are respectively connected to thethird sensing lines SL3 _(k) and SL3 _(k+1), may extend parallel to thethird sensing lines SL3 _(k) and SL3 _(k+1). The third sensing lines SL3_(k) and SL3 _(k+1) may be respectively connected to the bridge patternsCP1 and CP2 through second coupling portions CT_L1 and CT_L2.

The n-th line SL2 _(n) of the second sensing lines SL2 may extend tocross the bridge patterns CP1 and CP2. The bridge patterns CP1 and CP2may be spaced apart from each other by a second gap G2 and each of themmay have a second width W2. The second gap G2 and the second width W2may be values defined in the second direction DR2. Although the bridgepatterns CP1 and CP2 are illustrated to have the second width W2,embodiments are not limited to this example or a specific embodiment.For example, the bridge patterns CP1 and CP2 may be provided to havedifferent widths.

Referring to FIG. 7A, the third sensing lines SL3 _(k) and SL3 _(k+1)may be disposed between the first sensing insulating layer 221 and thesecond sensing insulating layer 222, and the bridge patterns CP1 and CP2may be disposed between the second sensing insulating layer 222 and thethird sensing insulating layer 223. As such, in some embodiments, thebridge patterns CP1 and CP2 may be disposed at a level (or layer)different from the third sensing lines SL3 _(k) and SL3 _(k+1) and maybe disposed on the third sensing lines SL3 _(k) and SL3 _(k+)1.

The first width W1 may be within a range of feature sizes that can beachieved by a process of patterning the third sensing lines SL3 _(k) andSL3 _(k+1). Since each of the third sensing lines SL3 _(k) and SL3_(k+1) is provided to have at least the first width W1, it may bepossible to prevent the third sensing lines SL3 _(k) and SL3 _(k+1) frombeing incompletely patterned by the patterning process. In someembodiments, the first width W1 may be greater than or equal to, forexample, about 4 μm.

The first gap G1 may be within a range of feature sizes that can beachieved by the patterning process of the third sensing lines SL3 _(k)and SL3 _(k+1). In some embodiments, the first gap G1 may be greaterthan or equal to, for example, about 7 μm.

The bridge patterns CP1 and CP2 may penetrate the second sensinginsulating layer 222 and may be coupled to the third sensing lines SL3_(k) and SL3 _(k+1), respectively. Each of the second coupling portionsCT_L1 and CT_L2 may be defined to penetrate the second sensinginsulating layer 222.

The second width W2 may be greater than or equal to the first width W1.For example, the second width W2 may be greater than or equal to about 4μm. Since each of the bridge patterns CP1 and CP2 is provided to have atleast the second width W2, it may provide an area for defining thesecond coupling portions CT_L1 and CT_L2.

The second gap G2 may be within a range of feature sizes that can bedistinguished by an optical inspection system used for an opticalinspection process on the bridge patterns CP1 and CP2. For example, insome embodiments, the second gap G2 may be greater than or equal toabout 3 μm.

In some embodiments, the bridge patterns CP1 and CP2 may be designed tobe spaced apart from each other by the second gap G2. Thus, even whenthere is a patterning failure (e.g., a reverse-tapered shape) of thethird sensing lines SL3 _(k) and SL3 _(k+1), it may be possible toprevent a disconnection failure from occurring in the bridge patternsCP1 and CP2. Thus, even when the third sensing lines SL3 _(k) and SL3_(k+1) are formed to have a fine width of, for example, about 4 μm, itmay be possible to stably maintain the electrical connections betweenthe second sensing lines SL2 and the third sensing lines SL3.Accordingly, the reliability of the input-sensing unit 220 may beimproved.

Referring to FIG. 7B, in a region overlapping the n-th line SL2 _(n) ofthe second sensing lines SL2 the bridge patterns CP1 and CP2 may have aflat shape without unevenness, but embodiments are not limited thereto.Accordingly, it may be possible to prevent the bridge patterns CP1 andCP2 from being cut by the n-th line SL2 _(n) of the second sensing lineSL2 disposed below the bridge patterns CP1 and CP2.

Referring to FIG. 7C, the bridge pattern CP1 may cross the n-th line SL2_(n) of the second sensing lines SL2 and may be coupled to the thirdsensing line SL3 _(k). The distance DS between the n-th line SL2 _(n) ofthe second sensing lines SL2 and the third sensing lines SL3 _(k) andSL3 _(k+1) may be limited within a range in which sectional shapes ofthe second and third sensing lines SL2 and SL3 can be easily controlledduring the patterning process of the second and third sensing lines SL2and SL3. For example, the distance DS between the n-th line SL2 _(n) ofthe second sensing lines SL2 and the third sensing lines SL3 _(k) or SL3_(k+1) may be greater than or equal to about 10 μm.

In an embodiment, each of the bridge patterns CP1 and CP2 may be asingle-continuous pattern that does not have any disconnected parts in aregion between the n-th line SL2 _(n) of the second sensing lines SL2and the third sensing lines SL3 _(k) and SL3 _(k+1). For instance, sincethe distance DS between the n-th line SL2 _(n) of the second sensinglines SL2 and the third sensing lines SL3 _(k) or SL3 _(k+1) may begreater than or equal to about 10 μm, it may be possible to prevent apatterning failure (e.g., a reverse-tapered shape) from occurring in then-th line SL2 _(n) of the second sensing lines SL2 and the third sensinglines SL3 _(k) and SL3 _(k+1). Accordingly, it may be possible toprevent a disconnection failure from occurring in the bridge patternsCP1 and CP2.

According to some exemplary embodiments, since the second sensing linesSL2 are connected to the third sensing lines SL3 through the bridgepatterns CP extending parallel to the third sensing lines SL3 it may bepossible to easily prevent disconnection failures or the like fromoccurring in the bridge patterns CP due to a patterning failure in thethird sensing lines SL3. Accordingly, the second and third sensing linesSL2 and SL3 may be easily designed to have an increased integrationdensity. In addition, the second sensing lines SL2 the third sensinglines SL3 and the bridge patterns CP may be designed in such a way thatdistances therebetween or widths thereof are within predeterminedranges, and this may make it possible to easily secure the reliabilityof the input-sensing unit 220.

FIG. 8A is a plan view illustrating a portion of an input-sensing unitaccording to some exemplary embodiments. FIG. 8B is a sectional view ofthe structure shown in FIG. 8A according to some exemplary embodiments.FIG. 9A is a plan view illustrating a portion of an input-sensing unitaccording to some exemplary embodiments. FIG. 9B is a sectional view ofthe structure shown in FIG. 9A according to some exemplary embodiments.Hereinafter, some exemplary embodiments will be described with referenceto FIGS. 8A to 9B. For concise description, an element previouslydescribed with reference to FIGS. 1A to 7C may be identified by the same(or similar) reference number without repeating an overlappingdescription thereof.

As shown in FIGS. 8A and 8B, one bridge pattern CP_1 may be connected toone third sensing line SL3 through one second coupling portion CT_La.Here, an area ARa of the coupling portion CT_La may be smaller than anoverlapping area between the third sensing line SL3 and the bridgepattern CP_1.

In addition, as shown in FIGS. 9A and 9B, an area ARb of a couplingportion CT_Lb may be larger than the area ARa of the coupling portionCT_La shown in FIG. 8B. Here, the bridge pattern CP_2 and the thirdsensing line SL3 may be maintained to the same sizes.

In an embodiment, as the area ARb of the second coupling portion CT_Lbincreases, the contacting area between the bridge pattern CP_2 and thethird sensing line SL3 may be increased, and thereby, a contactresistance between the bridge pattern CP_2 and the third sensing lineSL3 may be decreased. Accordingly, it may be possible to easily preventa voltage drop issue that may be caused by the coupling issue betweenthe bridge pattern CP_2 and the third sensing line SL3.

FIGS. 10A and 10B are plan views illustrating portions of input-sensingunits according to various exemplary embodiments. For convenience indescription, FIGS. 10A and 10B illustrate regions corresponding to theregion shown in FIG. 5 . Hereinafter, some exemplary embodiments will bedescribed with reference to FIGS. 10A and 10B. For concise description,an element previously described with reference to FIGS. 1A to 9B may beidentified by the same (or similar) reference number without repeatingan overlapping description thereof.

As shown in FIG. 10A, a plurality of bridge patterns CP-1 may includebridge patterns CPa, CPb, CPc, and CPd whose shapes (or sizes) aredifferent from each other. For convenience in illustration, four bridgepatterns CPa, CPb, CPc, and CPd, which correspond to four second sensinglines SL2 ₁, SL2 ₂, SL2 _(n−1), and SL2 _(n) and four third sensinglines SL3 ₁, SL3 ₂, SL3 _(n−n), and SL3 _(n), are shown.

Each of the bridge patterns CPa, CPb, CPc, and CPd may extend along aopposite direction of the first direction DR1 to be overlapped with acorresponding one of the second sensing lines SL2 on which thecorresponding coupling portion CT is defined. For instance, the bridgepatterns CPa, CPb, CPc, and CPd may have extension lengths differentfrom each other, and the number of the second sensing lines SL2overlapped with the bridge patterns CPa, CPb, CPc, and CPd in a planview may be different from each other.

For example, the bridge pattern CPa connecting the first line SL2 ₁ ofthe second sensing lines SL2 to the first line SL3 ₁ of the thirdsensing lines SL3 may extend to be overlapped with all of the secondsensing lines SL2. For instance, the bridge pattern CPa connecting thefirst line SL2 ₁ of the second sensing lines SL2 to the first line SL3 ₁of the third sensing lines SL3 may be overlapped with n second sensinglines SL2 ₁, SL2 ₂, . . . , SL2 _(n−1), and SL2 _(n).

The bridge pattern CPb connecting the second line SL2 ₂ of the secondsensing lines SL2 to the second line SL3 ₂ of the third sensing linesSL3 may extend to be overlapped with the second line SL2 ₂ of the secondsensing lines SL2 but may not be overlapped with the first line SL2 ₁ ofthe second sensing lines SL2 when viewed in a plan view. The bridgepattern CPb connecting the second line SL2 ₂ of the second sensing linesSL2 to the second line SL3 ₂ of the third sensing lines SL3 may beoverlapped with (n−1) second sensing lines SL2 ₂, SL2 _(n−1), and SL2_(n) when viewed in a plan view.

The bridge pattern CPc connecting the (n−1)-th line SL2 _(n−1) of thesecond sensing lines SL2 to the (n−1)-th line SL3 _(n−1) of the thirdsensing lines SL3 may extend to be overlapped with the (n−1)-th line SL2_(n−1) of the second sensing lines SL2. As such, the bridge pattern CPcconnecting the (n−1)-th line SL2 _(n−1) of the second sensing lines SL2to the (n−1)-th line SL3 _(n−1) of the third sensing lines SL3 may beoverlapped with only the (n−1)-th line SL2 _(n−1) of the second sensinglines SL2 and the n-th line SL2 _(n) of the second sensing lines SL2.The bridge pattern CPc connecting the (n−1)-th line SL2 _(n−1) of thesecond sensing lines SL2 to the (n−1)-th line SL3 _(n−1) of the thirdsensing lines SL3 may be overlapped with two second sensing lines SL2_(n−1) and SL2 _(n) when viewed in a plan view.

The bridge pattern CPd connecting the n-th line SL2 _(n) of the secondsensing lines SL2 to the n-th line SL3 _(n) of the third sensing linesSL3 may extend to be overlapped with only the n-th line SL2 _(n) of thesecond sensing lines SL2. The bridge pattern CPd connecting the n-thline SL2 _(n) of the second sensing lines SL2 to the n-th line SL3 _(n)of the third sensing lines SL3 may not be overlapped with the others ofthe second sensing lines SL2 except for the n-th line SL2 _(n) of thesecond sensing lines SL2 when viewed in a plan view. The bridge patternCPd connecting the n-th line SL2 _(n) of the second sensing lines SL2 tothe n-th line SL3 _(n) of the third sensing lines SL3 may be overlappedwith one second sensing line SL2 _(n) when viewed in a plan view. Insome embodiments, it may be possible to reduce a total overlapping areabetween the bridge patterns CP-1 and the second sensing lines SL2 ascompared with the bridge patterns CP of FIG. 5 . Thus, it may bepossible to reduce a parasitic capacitance between the second sensinglines SL2 and the bridge patterns CP-1, and thereby, improve theelectric reliability of the input-sensing unit 220.

In an embodiment, such as shown in FIG. 10B, a plurality of bridgepatterns CP_(S1) to CPS_(n−1) may be provided to be arranged in thesecond direction DR2. For example, the bridge patterns CP_(S1) toCPS_(n−1) may include sub-patterns CP_(S1) to CPS_(n−1) constituting aplurality of rows, which are extended in the first direction DR1 and arearranged in the second direction DR2. In some embodiments, third sensinglines SL3-A may be arranged in a reverse order from that of the thirdsensing lines SL3 shown in FIG. 10A. However, embodiments are notlimited to a specific arrangement order of the third sensing linesSL3-A, and the arrangement order of the third sensing lines SL3-A may bevariously changed.

In each row, the sub-patterns CP_(S1) to CPS_(n−1) may be connected toeach other through line patterns LL₁ to LL_(n−1). For example, thesub-patterns CP_(S1), which constitute the first row of the sub-patternsCP_(S1) to CPS_(n−1), may be connected to each other through a pluralityof line patterns LL₁ to electrically connect the first line SL2 ₁ of thesecond sensing lines SL2 to the first line SL3 ₁ of the third sensinglines SL3-A. The sub-patterns CP_(S2), which constitute the second rowof the sub-patterns CP_(S1) to CPS_(n−1), may be connected to each otherthrough a plurality of line patterns LL₂ to electrically connect thesecond line SL2 ₂ of the second sensing lines SL2 to the second line SL3₂ of the third sensing lines SL3-A. In addition, the sub-patternCPS_(n−1), which constitutes the (n−1)-th row of the sub-patternsCP_(S1) to CPS_(n−1), may be a single pattern. The sub-pattern CPS_(n−1)constituting the (n−1)-th row may be connected to the (n−1)-th line SL2_(n−1) of the second sensing lines SL2 through a single line patternLL_(n−1) and may be coupled to the (n−1)-th line SL3 _(n−1) of the thirdsensing lines SL3-A. The n-th line SL2 _(n) of the second sensing linesSL2 may be directly connected to the n-th line SL3 _(n) of the thirdsensing lines SL3-A. However, embodiments are not limited to thisexample or a specific embodiment, and in some exemplary embodiments, anadditional sub-pattern may be further provided to connect the n-th lineSL2 _(n) of the second sensing lines SL2 to the n-th line SL3 _(n) ofthe third sensing lines SL3-A.

According to some embodiments, the sub-patterns CP_(S1) to CPS_(n−1) maybe disposed on a layer different from the second and third sensing linesSL2 and SL3-A or the line patterns LL₁ to LL_(n−1). The sub-patternsCP_(S1) to CPS_(n−1) may be disposed in a region overlapped with thesecond sensing lines SL2 and thus, the second sensing lines SL2 may bestably connected to corresponding ones of the third sensing lines SL3-A,without interference by other third sensing lines SL3-A adjacentthereto. According to some embodiments, the bridge patterns CP_(S1) toCPs_(n−1) may be designed in various shapes, and embodiments are notlimited to a specific shape or structure of the bridge patterns CP_(S1)to CPS_(n−1).

FIGS. 11A and 11B are exploded perspective views illustrating anelectronic apparatus according to various exemplary embodiments. FIG.12A is an exploded perspective view illustrating an electronic panelaccording to some exemplary embodiments. FIG. 12B is a plan viewillustrating an electronic panel according to some exemplaryembodiments. FIGS. 11A and 11B illustrate exploded perspective views,which are presented to describe a bendable structure of an electronicpanel 200-1. Hereinafter, some exemplary embodiments will be describedwith reference to FIGS. 11A to 12B.

As shown in FIG. 11A, an electronic apparatus EA-1 may include a window100-1, an electronic panel 200-1, and an outer case 300-1. The window100-1 and the outer case 300-1 may correspond to the window 100 and theouter case 300 as respectively described above, and thus, an overlappingdescription thereof will be omitted.

The electronic panel 200-1 may include a flexible or bendable portion.For example, the electronic panel 200-1 may include a non-bendingportion NBR and a bending portion BR. The electronic panel 200-1 in anexemplary non-bent state is illustrated in FIG. 11A, and the electronicpanel 200-1 in an exemplary bent state is illustrated in FIG. 11B.

The bending portion BR may be bent along a bending axis extending in thefirst direction DR1. The bending axis may be defined on the rear surfaceof the electronic panel 200-1.

Since the bending portion BR is bent to enclose the bending axis, anarea of the peripheral region NAA-1 of the front surface IS-1 of theelectronic panel 200-1 as seen from the front surface FS-1 of the window100-1 may be reduced in the structure of FIG. 11B than in the structureof FIG. 11A. Accordingly, the bezel region BZA-1 may be reduced toimprove the aesthetic quality of the electronic apparatus EA-1. However,embodiments are not limited to this example, and in some embodiments,the bending portion BR may be omitted from the electronic panel 200-1.

In some embodiments, the electronic panel 200-1 may include a pluralityof pads PD disposed in (or on) the bending portion BR. The electronicapparatus EA-1 may further include the flexible circuit board CF, whichis connected to the pads PD, and a main board MB connected to theflexible circuit board CF. If the electronic panel 200-1 is bent, theflexible circuit board CF and the main board MB may be placed on therear surface of the electronic panel 200-1 and may not be seen throughthe front surface FS-1 of the window 100-1. Accordingly, the bezelregion BZA-1 may be reduced, and thus, the aesthetic quality of theelectronic apparatus EA-1 may be improved.

The flexible circuit board CF may include an insulating film andconductive lines mounted on the insulating film. The conductive linesmay be coupled to the pads PD to electrically connect the electronicpanel 200-1 to the main board MB. In some embodiments, the flexiblecircuit board CF may be omitted, and in this case, the main board MB maybe directly coupled to the electronic panel 200-1.

The main board MB may include signal lines and electronic devices. Theelectronic devices may be coupled to the signal lines and may beelectrically connected to the electronic panel 200-1. The electronicdevices may generate various electrical signals (e.g., for generatingthe image IM of FIG. 1A or for sensing the user's input TC of FIG. 1A)or may process sensed signals. In an embodiment, the main board MB mayinclude a plurality of electronic components for all signals, which willbe generated or processed, but is embodiments are not limited to thisexample or a specific embodiment.

Referring to FIGS. 12A and 12B, the bending portion BR and thenon-bending portion NBR may be substantially defined in a base substrateBS of a display unit 210-1. The base substrate BS may be bent by anexternal force. For example, the base substrate BS may have a flexibleproperty. The base substrate BS may be provided in the form of, forexample, a resin film (e.g., a polyimide (PI) film). In someembodiments, the base substrate BS may be formed of a plurality offilms, such as a plurality of resin films. At least two of the resinfilms may be made materials different from one another.

The display unit 210-1 may include a plurality of signal lines GL, DL,and PL, a plurality of pixels PX, and a plurality of pads PD, which aredisposed on the base substrate BS. The signal lines GL, DL, and PL andthe pixels PX may be configured to have substantially the same featuresas previously described, and thus, an overlapping description will beomitted.

The pads PD may include display pads PDD and sensing pads PDT. Each ofthe display pads PDD may be connected to a corresponding signal line ofthe signal lines GL, DL, and PL through a first routing line RL-D. Thedisplay pads PDD may be coupled to the flexible circuit board CF todeliver electrical signals, which are received from the main board MB,to corresponding ones of the signal lines GL, DL, and PL.

The sensing pads PDT may be spaced apart from the display pads PDD inthe first direction DR1. The sensing pads PDT may receive electricalsignals, which are used for an input-sensing unit 220-1, from the mainboard MB or may deliver electrical signals, which are produced by theinput-sensing unit 220-1, to the main board MB. The sensing pads PDT maybe electrically connected to the input-sensing unit 220-1 through secondrouting lines RL-T.

The input-sensing unit 220-1 may be disposed on the display unit 210-1.The input-sensing unit 220-1 may include a plurality of first sensingelectrodes TE1, a plurality of second sensing electrodes TE2, aplurality of first sensing lines TL1, a plurality of second sensinglines TL2, and a plurality of third sensing lines TL3.

Each of the first sensing electrodes TE1 may include a plurality of thefirst sensing patterns SP1 and a plurality of the first connectionpatterns BP1, and each of the second sensing electrodes TE2 may includea plurality of the second sensing patterns SP2 and a plurality of thesecond connection patterns BP2. The first sensing electrodes TE1 and thesecond sensing electrodes TE2 may be configured to have substantiallythe same features as those of the first sensing electrodes SE1 and thesecond sensing electrodes SE2 previously described, and thus, anoverlapping description will be omitted.

The first sensing lines TL1 may be connected to first ends TE1_S1 of thefirst sensing electrodes TE1 that oppose second ends TE1 S2 of the firstsensing electrodes TE1, respectively. The second sensing lines TL2 maybe connected to first ends TE2_S1 of the second sensing electrodes TE2,respectively. In some embodiments, the first and second sensing linesTL1 and TL2 may be connected to the second routing lines RL-T,respectively, through terminal portions TP.

The terminal portions TP may connect the first and second sensing linesTL1 and TL2 to the second routing lines RL-T of the display unit 210-1.The terminal portions TP may be conductive patterns in direct contactwith the second routing lines RL-T, or conductive patterns thatpenetrate an insulating layer and are coupled to the second routinglines RL-T. According to some embodiments, since the input-sensing unit220-1 further includes the terminal portions TP, the input-sensing unit220-1 may be easily connected to the sensing pads PDT through the secondrouting lines RL-T, which are disposed in (or as part of) the displayunit 210-1.

The third sensing lines TL3 may be connected to second ends TE2_S2 ofthe second sensing electrodes TE2. The third sensing lines TL3 may berespectively connected to the second sensing lines TL2 through thecoupling portions CT. Accordingly, the third sensing lines TL3 mayreceive the same electrical signals as those of the second sensing linesTL2 from the sensing pads PDT connected through the terminal portionsTP.

According to some exemplary embodiments, the sensing pads PDT and thedisplay pads PDD may be provided in (or on) a single substrate (e.g.,the base substrate BS). Thus, the sensing pads PDT and the display padsPDD may be connected to the main board MB through a single flexiblecircuit board CF, and this may make it possible to simplify a process ofmanufacturing and assembling the electronic apparatus EA-1.

According to some exemplary embodiments, the second sensing lines TL2and the third sensing lines TL3 may receive electrical signals throughthe same sensing pads PDT. As such, even when additional sensing padsPDT are not added for the third sensing lines TL3, the input-sensingunit 220-1 may be configured to realize uniform sensitivity throughoutthe entire top surface of the active region AA.

According to some exemplary embodiments, it may be possible to providean input-sensing unit, whose signal line density and reliability areimproved, and an electronic apparatus including the same. In addition,it may be possible to prevent the number of pads in the input-sensingunit from being increased, and thereby, to more efficiently andeffectively manufacture and assemble an electronic apparatus.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theaccompanying claims and various obvious modifications and equivalentarrangements as would be apparent to one of ordinary skill in the art.

What is claimed is:
 1. An input-sensing unit, comprising: first sensingelectrodes; second sensing electrodes electrically insulated from thefirst sensing electrodes; first sensing lines respectively connected tothe first sensing electrodes; second sensing lines respectivelyconnected to first ends of the second sensing electrodes; third sensinglines respectively connected to second ends of the second sensingelectrodes, the second ends opposing the first ends; and bridge patternsrespectively connecting the second sensing lines to the third sensinglines, wherein: in a plan view, the bridge patterns are spaced apartfrom the first sensing electrodes and the second sensing electrodes,each of the bridge patterns comprises a transparent conductive oxide, adistance between each of the third sensing lines and an adjacent secondsensing line closest thereto is greater than or equal to 10 μm.
 2. Theinput-sensing unit of claim 1, wherein the bridge patterns extend in adirection crossing the second sensing lines.
 3. The input-sensing unitof claim 2, wherein the bridge patterns are disposed on at least some ofthe second sensing lines.
 4. The input-sensing unit of claim 1, whereinthe first sensing lines and the second sensing lines are disposed on asame layer as the third sensing lines.
 5. The input-sensing unit ofclaim 4, wherein: each of the first sensing electrodes comprises: firstsensing patterns; and first connection patterns disposed between andconnecting adjacent first sensing patterns among the first sensingpatterns; each of the second sensing electrodes comprises: secondconnection patterns disposed on a different layer than the firstconnection patterns; and second sensing patterns connected to the secondconnection patterns; the bridge patterns are disposed on a same layer asa layer on which one of the first connection patterns and the secondconnection patterns is disposed; and the third sensing lines aredisposed on a same layer as a layer on which the other of the firstconnection patterns and the second connection patterns is disposed. 6.The input-sensing unit of claim 1, further comprising: first padsrespectively connected to the first sensing lines; and second padsrespectively connected to the second sensing lines, wherein, in a planview, the second pads are spaced apart from the third sensing lines. 7.The input-sensing unit of claim 6, wherein each of the bridge patternsextends in a direction parallel to an arrangement direction of the firstpads and the second pads.
 8. The input-sensing unit of claim 1, whereinthe bridge patterns have a same shape as one another.
 9. Theinput-sensing unit of claim 8, wherein each of the bridge patternselectrically connected to each of the second sensing lines, and in aplan view, each of the bridge patterns overlaps with all of the secondsensing lines.
 10. The input-sensing unit of claim 1, wherein, in a planview, each of the bridge patterns overlaps a different number of thesecond sensing lines.
 11. The input-sensing unit of claim 1, whereineach of the third sensing lines comprises metal.
 12. An electronicapparatus, comprising: a display unit comprising a base substrate, andpixels disposed on the base substrate; and an input-sensing unitdisposed on the display unit, the input-sensing unit comprising: sensingelectrodes; first sensing lines respectively connected to first ends ofthe sensing electrodes; second sensing lines respectively connected tosecond ends of the sensing electrodes, the second ends opposing thefirst ends; and bridge patterns crossing at least some of the firstsensing lines and respectively connecting the first sensing lines to thesecond sensing lines, wherein: in a plan view, the bridge patterns arespaced apart from the sensing electrodes, each of the bridge patternscomprises a transparent conductive oxide, a distance between each of thefirst sensing lines and an adjacent second sensing line closest theretois greater than or equal to 10 μm.
 13. The electronic apparatus of claim12, wherein, in a plan view, the bridge patterns overlap with the firstsensing lines.
 14. The electronic apparatus of claim 13, wherein each ofthe bridge patterns extends in a direction parallel to an extensiondirection of each of the second sensing lines.
 15. The electronicapparatus of claim 12, wherein: each of the second sensing linescomprises metal.
 16. The electronic apparatus of claim 12, furthercomprising: sensing pads respectively connected to the first sensinglines, wherein, in a plan view, the sensing pads are spaced apart fromthe second sensing lines.
 17. The electronic apparatus of claim 16,wherein the sensing pads are disposed on the base substrate.
 18. Theelectronic apparatus of claim 16, wherein the sensing pads are disposedon the display unit.
 19. The electronic apparatus of claim 12, whereineach of the bridge patterns extends in a direction parallel to thesecond sensing lines.